Anirudh Devgan

Hear from Lip-Bu Tan at a fireside chat with Anirudh Devgan! At #CadenceLIVE 2025, Lip-Bu Tan, CEO of Intel Corporation and Anirudh Devgan, CEO of Cadence, sat down for a powerful fireside chat to discuss the future of technology. They covered an exciting range of topics, including the importance of fostering a customer-first, innovation-driven engineering culture and the strategies needed to redefine semiconductor and AI advancements in this rapidly evolving landscape. Hear how Lip-Bu is reshaping Intel’s approach to AI, from creating new purpose-built chips to promoting startup-style agility for faster innovation. Anirudh shares insights on how EDA tools and AI-driven workflows are revolutionizing chip design to improve performance, cost, and execution timelines. The conversation also dives into the pivotal role leadership plays in navigating industry challenges, attracting top talent, and building trusted partnerships across the tech ecosystem. Watch now: https://ow.ly/WeTE30sMwno #Innovation #AI #Leadership #Semiconductors #FutureTech

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We are honored to announce Brandon Wang, Vice President of Synopsys, as our distinguished opening keynote speaker at this year's CIE-SF Annual Conference. | June 7, 2025 | Sunnyvale In today's rapidly evolving technological landscape, understanding how to implement AI effectively is what separates theoretical innovation from practical business value. Mr. Wang brings valuable industry perspective on AI's transformative potential and strategic implementation across sectors. Title: Re-Engineering Engineering: Navigating the Future with AI-Driven Intelligent Systems Abstract: Delivering software-defined intelligent systems and AI silicon across diverse applications—from data centers to Automous machines—poses immense challenges due to unprecedented complexity and the accelerating pace of innovation. Traditional engineering approach are no longer sufficient. To meet this moment, a new engineering paradigm, augmented by AI, is required - we must re-engineer engineering. This keynote will explore the three waves of AI evolution, strategies to optimize AI development by balancing quality, speed, and cost, and the rise of AI agent technologies and their implications for the future of work. Event Website: https://lnkd.in/gbbX4H_q #AI #CIE-SF #Annual_Conference #Re-Engineering

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It feels like most of the semiconductor industry descended on Phoenix for SEMICON West, and honestly, it was exciting to explore the companies shaping the future of manufacturing! It reminded me of our firm’s roots (36 years in semiconductors) and offered glimpses of what the next three decades will look like. That said, there’s a noticeable difference in the scale of companies at SEMICON. Many are mature organizations that thrive on process and structure. Walking the halls, meeting with the titans of this sector made me crave the scrappiness and boldness of the founder-led startups we've come to work with. Which is exactly why I’m eager for the OCP Summit. Some of the key startups advancing the future of AI will be sharing what they’ve been building, and the conversations will center on open standards, innovation at the edge, and the people advancing AI. A few presentations are on my radar, and for good reason: Baya Systems - Open architectures are vital for heterogeneous computing. Without them, scaling AI would run through only a handful of companies—a concerning concentration of power. Baya is advancing open architectures with REAL solutions, and I’m eager to hear how Sailesh and his team are pushing their mission forward. d-Matrix - Last month at the AI Infra Summit, Sid unveiled JetStream, a PCIe I/O card that links their Corsair accelerator to deliver enterprise-grade inference. He also hinted at “more big news soon,” and I have a feeling OCP will be the stage for it. I’ll be keeping my eyes on Sree Ganesan's presentation. Axiado Corporation - Scaling AI with compromised hardware security is like racing in a boat full of holes; you’re just taking on water faster. Gopi and his team of “quiet builders” are tackling security at every layer, and I'm interested in Ben Levine's talk on their hardware-rooted AI Agents to hear how their approach will make AI safer and more responsible. Upscale AI - I met with Rajiv earlier this year, and he shared how their journey from crypto mining hardware to AI infrastructure was a natural evolution for their world-class engineering team. Upscale is now redefining open networking for AI scale-up and scale-out, and their panel with giants like Astera Labs, Intel, Synopsys, and UALink Consortium will be one not to miss! Eridu AI - With the energy demands of AI ballooning, efficiency isn't optional. Drew Perkins and his team are rethinking compute for AI through a sustainability lens, so large-scale deployments can be accessible AND responsible. They’ve made little noise, which always signals “heads down and building”, so I’m excited to hear about their progress. What excites me most about OCP isn’t just the tech, it’s the bold entrepreneurship and the PEOPLE. Innovation doesn’t just happen inside giant companies. More often, it happens in the hands of founders who see what others can’t yet imagine. If you’re going, reach out. I’d love to trade notes. #OCPSummit2025 #artificialintelligence #startups

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I am excited about India's commitment to be a global AI leader and have been following the action and excitement taking place at AI Summit taking place in Delhi, India. We at Applied Ventures, the Venture arm of Applied Materials are delighted be part of IDTA and look forward to playing a role with investments and partnerships to build a vibrant deep tech ecosystem in India.

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Ethernet is the Backbone of AI Infrastructure. And at Broadcom, we’re building that backbone—across every scale. Our portfolio of AI-optimized Ethernet switches spans the full range of AI datacenter needs—from node-level compute to region-wide scale-out. For scale-up and scale-out. Whether you’re tuning for latency, bandwidth, or network fabric efficiency, we have you covered: 👉Tomahawk Ultra – 51.2 Tbps Purpose-built for HPC and tightly coupled AI training clusters. Offers ultra-low latency at 250ns. It’s how you get deterministic high performance. Perfect for SCALE UP. 👉Tomahawk 6 – 102.4 Tbps The world’s highest-bandwidth Ethernet switch. Doubles the bandwidth of the previous gen while improving power efficiency. Think of it as the core fabric of modern AI systems. Think SCALE OUT. And also SCALE UP. 👉Jericho4 Our go-to switch for AI scale-out across regions. Offers astonishing scale to 36,000 HyperPorts, each operating at 3.2 Tb/s. It’s what connects multi-site AI clusters and ensures global scale with visibility. We’re proudly architecting the open, scalable, power-efficient networks AI will run on for the next decade. #AIInfrastructure #EthernetForAI #ConnectedByBroadcom #Networking

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🚨 Semiconductor Update India’s deep-tech ecosystem continues to gain momentum 🎉 Agnit Semiconductors has raised $2.6M to scale its Gallium Nitride (GaN) technology, targeting high-growth areas like telecom infrastructure and power electronics. This funding, backed by Shastra VC, 3one4 Capital, and Zephyr Peacock, reflects growing investor confidence in India’s semiconductor innovation ecosystem. 💡 As the industry evolves, advancements in materials like GaN will play a crucial role in shaping the future of chip design and performance. #Semiconductors #VLSI #GaN #ChipDesign #DeepTech #StartupIndia #Electronics #TechInnovation

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In case you missed it, iDEAL CTO, David Jauregui recently presented the webinar “Reengineering Silicon Power Devices,” hosted by SemiX - Center for Semiconductor Technologies at IIT Bombay. The full recording (including Q&A) is now live on YouTube: https://lnkd.in/eyCzv3U8 It’s a great technical overview of SuperQ, covering switching performance (QSW), EOSS, real application results, and reliability.

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Ayarlabs continues to strengthen its leadership team with the hiring of Sankara Venkateswaran. He brings deep experience in compute and networking acceleration and knows what it takes to deliver production quality products to market. The leading companies in the hyperscale-AI industry are looking to co-packaged optics as a necessity to break through the "copper wall" and Ayarlabs is positioned to deliver this solution to them.

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India stands at a defining moment in its semiconductor journey. As digital infrastructure expands, AI adoption accelerates, and strategic sectors increasingly rely on advanced electronics, semiconductors are no longer just components—they are foundational to national capability, economic resilience, and technological sovereignty. The opportunity ahead is not only to participate in the global value chain, but to shape it, by building indigenous design capabilities, accelerating innovation, and creating technologies that are designed, developed, and deployed from India to the world. I look forward to joining the Electronics & Semiconductor Manufacturing Summit on 12th March 2026 in Bengaluru, and engaging with industry leaders, policymakers, and innovators on how we can collectively accelerate India’s semiconductor future. The foundation is strong. The momentum is real. The future will be built here. #ETManufacturing #Semiconductors #DesigninIndia #ElectronicsManufacturing #MakeInIndia #AI

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Chip Design Services Provider Mirafra Tapes Out 22-nm SoC Yashasvini Razdan01.29.2026 Mirafra Technologies, a Bengaluru, India-based semiconductor design services company, has developed and taped out a 22-nm SoC called Ramanujan. The project is part of an internal effort to provide full end-to-end silicon delivery capability, rather than an attempt to enter the merchant chip market. Chip architecture and design Ramanujan is built around a dual network-on-chip (NoC) architecture that separates application processing from secure boot and system control functions, while allowing AXI-based (Advanced eXtensible Interface) communication between the two domains. The SoC integrates a single-core Arm Cortex-A55 application processor alongside a separate InCore Semiconductors RISC-V Azurite core for system and secure functions. The SoC supports external memory through SDRAM, Flash, and HyperRAM interfaces, along with on-chip SRAM and standard DMA-based data movement. Security and system management functions are implemented on a dedicated system and secure NoC. This includes the Azurite system manager from InCore Semiconductors, which handles secure boot and early system control before the application processor starts. https://lnkd.in/grZDZhhV

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LPDDR is advancing into data center applications in a big way. Join to get an insight on the standard and how to verify with ease the complex subsystems of an Soc that use LPDDR6.

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This compelling piece on India’s semiconductor roadmap features new McKinsey estimates that project the country could reduce chip imports by $10–20 billion annually by 2030. https://lnkd.in/g4iuXm-u These numbers aren’t just impressive, they signal real momentum. India’s semiconductor demand is expected to grow to $90–100 billion by 2030. And if we can localize 20–30% of that value chain, it would mark a huge leap toward self-reliance. From design-led incentives to a sharper focus on R&D, talent, and trusted supply chains, each piece plays a critical role. At Silicon Labs, we’ve seen firsthand how India is evolving from a talent hub into a true innovation partner. Our expanding R&D footprint and work with local ecosystem players reflect this belief: India isn’t just a market, it’s a global design and innovation engine in the making. The semiconductor journey is long but we’re clearly on the right track. #IndiaChipMission #DesignInIndia #SiliconLabs

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Hear from Lip-Bu Tan at a fireside chat with Anirudh Devgan! At #CadenceLIVE 2025, Lip-Bu Tan, CEO of Intel Corporation and Anirudh Devgan, CEO of Cadence, sat down for a powerful fireside chat to discuss the future of technology. They covered an exciting range of topics, including the importance of fostering a customer-first, innovation-driven engineering culture and the strategies needed to redefine semiconductor and AI advancements in this rapidly evolving landscape. Hear how Lip-Bu is reshaping Intel’s approach to AI, from creating new purpose-built chips to promoting startup-style agility for faster innovation. Anirudh shares insights on how EDA tools and AI-driven workflows are revolutionizing chip design to improve performance, cost, and execution timelines. The conversation also dives into the pivotal role leadership plays in navigating industry challenges, attracting top talent, and building trusted partnerships across the tech ecosystem. Watch now: https://ow.ly/2s4Z30sMt9n #Innovation #AI #Leadership #Semiconductors #FutureTech

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KEY TAKEAWAY: Cadence of San Jose (USA) has built a $90 billion market cap company as the leading electronic design automation ("EDA") company for integrated circuits used in AI and hyperscale computing. Cadence's moat combines that of Lonza and other others who work with customers in designing the end product, with that of DNP Dai Nippon Printing Co., Ltd., whose photomask products require approval and compatibility both with chip designers and with fabs. ____________________________ NVIDIA uses Cadence tools in chip design, which are then manufactured at the TSMC fab. This creates a "triad", aka three sided moat, whereby its design tools are intertwined with NVIDIA's performance requirements, and TSMC's manufacturing process hardware, rendering switching costs much higher than they would be with only one of the two partners. For example, Cadence’s Reality Digital Twin platform creates detailed, physics-based virtual replicas of entire data centers to simulate and optimize their design and operation. By integrating Cadence’s Reality Digital Twin with NVIDIA Omniverse and their DGX/GB200 supercomputing systems, the partnership creates a unified, realistic simulation environment where AI factories can be designed, simulated, and optimized before being physically built. TSMC uses this to turn traditional 2D CAD designs into interactive 3D virtual models, including clean rooms, utility layouts, and manufacturing lines. So not only is Cadence very difficult to replace as a necessary piece in an extremely complicated jigsaw process, it is essential in designing the entire process. Cadence's net income and free cash flow had been growing 16%-18% annually for the decade prior to 2021. Since that time, net income growth has accelerated as its legacy EDA software tools continued to sell, but free cash flow has stagnated, as Cadence moved into the hardware business, and inventory has ballooned. For example, Cadence's Millennium M2000 is a hardware EDA platform, packed with NVIDIA Blackwell GPUs, and cutting edge networking hardware, designed to vastly outperform Cadence's legacy EDA software tools running on generic hardware. But customers have been slow to switch, since they require proof of the claimed productivity leap. This has created an inventory issue that Cadence did not have as a software vendor. It could be just a matter of timing, if the value is eventually proven. Remember...stocks are fun but always wear a helmet. As always this is not investment advice, nor an endorsement of any product nor service. Next up, endoscopy. Gianmarco Paolo Conti Clarke Jeffries Jason Celino, CFA Charles Shi Nay Soe Naing Joe Quatrochi, CFA Blair Abernethy Gary Mobley

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Next week I’ll be delivering a keynote at 𝗖𝗵𝗶𝗽𝗹𝗲𝘁 𝗦𝘂𝗺𝗺𝗶𝘁 𝟮𝟬𝟮𝟲🎤, where I’ll cover why 𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝘃𝗶𝘁𝘆 𝗵𝗮𝘀 𝗯𝗲𝗰𝗼𝗺𝗲 𝘁𝗵𝗲 𝗽𝗿𝗶𝗺𝗮𝗿𝘆 𝗯𝗼𝘁𝘁𝗹𝗲𝗻𝗲𝗰𝗸—𝗮𝗻𝗱 𝗲𝗻𝗮𝗯𝗹𝗲𝗿—𝗼𝗳 𝗻𝗲𝘅𝘁‑𝗴𝗲𝗻𝗲𝗿𝗮𝘁𝗶𝗼𝗻 𝗰𝗵𝗶𝗽𝗹𝗲𝘁 𝗮𝗿𝗰𝗵𝗶𝘁𝗲𝗰𝘁𝘂𝗿𝗲𝘀. I’ll walk through what we’ve learned from real multi‑die deployments, the shift toward electrical + optical integration, and the challenges we still need to solve at system scale. 🚀 There’s also a strong lineup of technical content coming from the team at 𝗔𝗹𝗽𝗵𝗮𝘄𝗮𝘃𝗲 𝗦𝗲𝗺𝗶 – 𝗮 𝗤𝘂𝗮𝗹𝗰𝗼𝗺𝗺 𝗰𝗼𝗺𝗽𝗮𝗻𝘆🚀 Our work across high‑performance D2D, electrical and optical I/O chiplets, and advanced packaging is accelerating the industry’s move toward modular, system‑architected compute. 🤘 Archana P Cheruliyil, Soni Kapoor, David Kulansky, Sue Hung F., Michael Klempa Nirmal Kshetrapalan Daniel Lambalot 🤘 Looking forward to connecting with partners, customers, and chiplets friends. #ChipletSummit #Chiplets #Connectivity #OpticalIO #CPO #NPO #SerDes #AdvancedPackaging #UCIe #AIInfrastructure #Semiconductors #Qualcomm https://lnkd.in/gqxqdJdJ

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I enjoyed joining Patrick Moorhead and Daniel Newman at #MWC26 to discuss how AI is reshaping the network and what that means for compute, architecture, and operators.   Cristina Rodriguez and I shared our perspective on the role of Xeon, why open platforms matter for operators, and how the industry is preparing for the transition toward AI-native 6G.   Appreciate the conversation. 

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In an interview, Nikul S., Co-Founder and CEO of IndieSemiC, discusses with Kajal Mehra from TimesTech Buzz, how IndieSemiC is advancing indigenous chip design through market-aligned innovation, strategic partnerships, and capital-efficient execution within India’s evolving semiconductor ecosystem. #Semiconductors #ChipDesign #IndiaTech #InnovationEcosystem #EDA #MakeInIndia #TechLeadership #HardwareRevolution #electronicsnews #technologynews https://lnkd.in/gqW8yPJG

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