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  BGA Inspection
   
 
BGA Inspection Offered
 
  • Post Production Validation
  • Fault Detection and Evaluation
  • X-Ray Inspection
 
 
VJ Electronix X15LP
VJ Electronix X15LP
 
BGA Inspection for Bridges - (X-Ray)
BGA Inspection is an excellent method for identifying bridges between solder balls.
BGA Inspection for Bridges
 
BGA Inspection for Poor Wetting / Insufficient – (X-Ray)
eTech's BGA Inspection procedures can identify poor wetting and
insufficient reflow of a reworked BGA component.		 BGA Inspection for Poor Wetting / Insufficient
 
BGA Inspection for Diameter, area and Joint Density -
(X-Ray)
Calculation of Various measurements such as diameter, area, and joint density of solder balls on a BGA placement can be analyzed at eTech
BGA Inspection for Diameter, area and Joint Density
 
BGA Inspection and Analysis tool – (X-Ray)
Areas of interest can be analyzed within the BGA and balls above or below a specified size can be highlighted
BGA Inspection and Analysis tool
 
BGA Inspection using 3D Rendering - (X-Ray)
This is an example of 3D rendering. In this example, voids are pronounced and easily detectible
BGA Inspection using 3D Rendering
 
BGA Inspection using Pseudo Color Filter Analysis - (X-Ray)
Our Pseudo Color filter tool enhances the analysis of voiding. A percent analysis can be performed on any area of interest
BGA Inspection using Pseudo Color Filter Analysis
 
Gull Wing Alignment - (X-Ray)
This example shows and example of an axis view of a .5mm gull wing lead
Gull Wing Alignment
 
Wirebond Analysis - (X-Ray)
This example is a view of wirebonds at high magnification
Wirebond Analysis
 
BGA Inspection using Contour Relief Filter - (X-Ray)
Contour filter highlights any voiding within each solder ball.
BGA Inspection using Contour Relief Filter